|
|
|
|
|
|
|
|
|
Rogers-RO4360-RF-Circuit-Board-32mil-2-Layer-High-Frequency-PCB-With-Immersion-Gold- for-Power-Amplifiers |
|
|
(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
|
|
|
|
|
RO4360G2 PCBs by Rogers Corporation are high-performance materials with a dielectric constant (Dk) of 6.15, offering low loss and excellent processability. These glass-reinforced, hydrocarbon ceramic-filled thermoset materials are designed to provide a perfect balance of performance and ease of use. RO4360G2 laminates support lead-free processes and offer increased rigidity, improving manufacturability in multi-layer board constructions while lowering material and fabrication costs.
Compatible with automated assembly, RO4360G2 high frequency PCBs process like FR-4 and feature a low Z-axis CTE for greater design flexibility. They maintain the high Tg of the RO4000 series and can be paired with RO4450F prepreg and lower-Dk RO4000 laminates for multi-layer designs.
With a Dk of 6.15 (Design Dk 6.4), Rogers RO4360G2 PCBs enable smaller circuit designs, making them ideal for applications where space and cost are critical. They are a top choice for power amplifiers, patch antennas, ground-based radar, and other RF applications, delivering exceptional value and performance. |
|
|
|
|
|
Features and benefits: |
|
|
1. Thermoset Resin System Tailored for 6.15 Dk:
1). Easy-to-process, similar to FR-4.
2). Consistent material performance across batches.
3). Low dielectric loss for superior signal integrity.
4). High thermal conductivity for efficient heat dissipation.
5). Cost-effective solution compared to competing PTFE-based products.
2. Low Z-Axis CTE and High Tg:
1). Enhanced design flexibility.
2). Reliable plated through-hole performance.
3). Automated assembly compatible
3. Environmentally Friendly:
1). Lead free process compatible
4. Regional Finished Goods Inventory:
1). Short lead times and fast inventory turnover.
2). Efficient supply chain. |
|
|
|
|
|
Some Typical Applications: |
|
|
1. Base Station Power Amplifiers
2. Small Cell Transceivers
3. Patch antennas
4. Ground-based Radar |
|
|
|
|
|
.jpg) |
|
|
|
|
|
PCB Capability(RO4360G2) |
|
|
PCB Capability (RO4360G2) |
PCB Material: |
Hydrocarbon Ceramic-filled Thermoset Materials |
Designation: |
RO4360G2 |
Dielectric constant: |
6.15 ±0.15 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm) |
|
|
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold etc.. |
|
|
|
|
|
|
Data Sheet of RO4360G2 PCB |
|
|
RO4360G2 Typical Value |
Property |
RO4360G2 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
6.15±0.15 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
|
|
|
|
2.5 GHz/23℃ |
|
Dissipation Factor,tanδ |
0.0038 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Conductivity |
0.75 |
|
W/mK |
50℃ |
ASTM D-5470 |
Volume Resistivity |
4.0 X 1013 |
|
Ω.cm |
Elevated T |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
9.0 X 1012 |
|
Ω |
Elevated T |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
784 |
Z |
V/mil |
|
IPC-TM-650 2.5.6.2 |
Tensile Strength |
131 (19) 97(14) |
X Y |
MPa (kpsi) |
40 hrs 50%RH/23 |
ASTM D638 |
Flexural Strength |
213(31) 145(21) |
X Y |
Mpa (kpsi) |
40 hrs 50%RH/23 |
IPC-TM-650, 2.4.4 |
Coefficient of Thermal Expansion |
13 14 28 |
X Y Z |
ppm/℃ |
-50 ℃to 288℃ After Replicated Heat Cycle |
IPC-TM-650, 2.1.41 |
Tg |
>280 |
|
℃ TMA |
|
IPC-TM-650 2.4.24.3 |
Td |
407 |
|
℃ |
|
ASTM D3850 using TGA |
T288 |
>30 |
Z |
min |
30 min / 125℃ Prebake |
IPC-TM-650 2.2.24.1 |
Moisure Absorption |
0.08 |
|
% |
50℃/48hr |
IPC-TM-650 2.6.2.1 ASTM D570 |
Thermal Coefficient of er |
-131 @10 GHz |
Z |
ppm/℃ |
-50℃ to 150 ℃ |
IPC-TM-650, 2.5.5.5 |
Density |
2.16 |
|
gm/cm3 |
RT |
ASTM D792 |
Copper Peel Stength |
5.2 (0.91) |
|
pli (N/mm) |
Condtion B |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 File QMTS2. E102765 |
|
|
|
|
|
|
|
|
|
|
|
|
Hot Tags:
Rogers RO4360 PCB |
Rogers Dural Layer PCB |
Double Sided PCB Board |
Rogers RO4360G2 RF PCB |
Immersion Gold PCB Board |
|
|
|